Scotland Launches Key Chip Packaging Facility
Scotland has unveiled a groundbreaking facility for advanced semiconductor packaging in Glasgow, marking a major step toward strengthening Europe's tech supply chains. The National Advanced Semiconductor Packaging and Integration Centre, known as NASPIC, opens as the first open-access site of its kind on the continent, aiming to speed up innovation in vital components for AI and beyond. The Growing Need for Advanced Semiconductor Packaging Semiconductors power everything from smartphones to electric vehicles, and their packaging plays a key role in making them work better. This process involves more than just protecting chips; it now shapes how devices handle power, heat,…
